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HP Mobile Thin Client Elite mt645 G8. Product type: Mobile thin client, Form factor: Clamshell. Processor family: AMD Ryzen™ 3, Processor model: 7335U, Processor frequency: 3 GHz. Display diagonal: 14", HD type: WUXGA, Display resolution: 1920 x 1200 pixels. Internal memory: 8 GB, Internal memory type: DDR5-SDRAM. Total storage capacity: 256 GB, Storage media: SSD. On-board graphics card model: AMD Radeon 660M. Operating system installed: HP ThinPro OS. Product color: Silver

The IntelliSkin® Next Generation protective sleeve for the Samsung Galaxy Tab A 8.0 (2019) includes all the great features of the original IntelliSkin® while adding several enhancements. An insert molded redesign of the skin combines a hard plastic shell with soft, shock-absorbing rubber. Ruggedized contacts for repetitive docking in field applications remain on the exterior, but are now flat to collect less dirt and allow for easier cleaning. And an integrated USB Type-C connector at the bottom of the skin allows for device charging even when you don’t have a GDS® Dock™ available. Like the original IntelliSkin®, these sleeves still provide military-grade drop protection and prevent damage to your device’s charging port from constant docking with an integrated GDS® connector molded directly into the skin. The IntelliSkin® Next Generation for the Samsung Galaxy Tab A 8.0 (2019) is compatible with a variety of GDS® Docks™ and accessories, as well as new docking cups for upgrading existing GDS® vehicle docks.

HP Elite Mini 800 G9 Desktop PC. Processor family: Intel® Core™ i7, Processor model: i7-14700T. Internal memory: 32 GB, Internal memory type: DDR5-SDRAM, Memory clock speed: 4800 MHz. Total storage capacity: 1 TB, Storage media: SSD. On-board graphics card model: Intel UHD Graphics 770. Wi-Fi. Operating system installed: Windows 11 Pro. Power supply: 90 W. Chassis type: Mini PC. Product type: Mini PC. Weight: 3.13 lbs (1.42 kg). Product color: Black

The Supermicro MBI-6219B-T63N is a high-density MicroBlade server node engineered for the Supermicro 6U and 3U MicroBlade enclosure systems. Designed specifically for scale-out cloud environments, dedicated hosting, and content delivery networks (CDN), this node provides a balanced compute-to-power ratio. It leverages the Intel Xeon E3-1200 v6/v5 processor family and the Intel C236 chipset to deliver enterprise-grade performance within a modular, space-saving architecture.