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BenQ EZC5201BS. Connectivity technology: Wireless, Host interface: USB, Interface: WLAN. Product color: Black

The Lenovo ST650 V2 Platinum 8358 processor offers unparalleled performance with 32 cores and a base clock speed of 2.6 GHz, making it ideal for compute-intensive workloads. Its 250W TDP provides ample power for demanding server environments, including big data analytics and AI-driven applications. Built for scalability and reliability, this processor ensures seamless multitasking, making it a top choice for enterprise applications requiring high processing power.

The Lenovo ST650 V2 Gold 6336Y processor is designed for versatility and efficiency with 24 cores and a 2.4 GHz base clock speed. With a 185W TDP, it is well-suited for server environments that demand balanced performance for virtualization, data processing, and workload consolidation. Its robust architecture ensures consistent and reliable operations, making it an excellent choice for businesses looking to scale their server capabilities.

WINDFORCE COOLING SYSTEMThe WINDFORCE cooling system features three 90mm unique blade fans, alternate spinning, 7 composite copper heat pipes, a large copper plate directly touches the GPU, 3D active fans and Screen cooling, which together provide high efficiency heat dissipation.ALTERNATE SPINNINGReduce the turbulence of adjacent fans and increase airflow pressure.3D ACTIVE FANThe 3D Active Fan provides semi-passive cooling, and the fans will remain off when the GPU is in a low load or low power game.UNIQUE BLADE FANThe airflow is spilt by the triangular fan edge, and guided smoothly through the 3D stripe curve on the fan surface.LARGE COPPER PLATE & HEAT-PIPEThe large copper plate directly contacts the GPU, coupled with the composite heat pipes, which quickly transfers the heat of the GPU and VRAM to the heatsink.SCREEN COOLINGExtended heatsink allows air to pass through, providing better heat dissipation.RGB FUSIONWith 16.7M customizable color options and numerous lighting effects, you can choose any lighting effect or synchronize with other devices in GIGABYTE CONTROL CENTER.PROTECTION METAL BACK PLATEThe metal back plate not only provides an aesthetical shape, but also enhances the structure of the graphics card to provide complete protection.DUAL BIOSThe factory default setting is OC mode, which provides users with the best performance. However, switching to silent mode will enjoy a quieter experience.POWER INDICATORWhen experiencing any power supply abnormality, the indicator will alert gamers by flashing light.BUILT STRONGULTRA DURABLEUltra Durable certified highest-grade metal chokes, lower ESR solid capacitors, 2oz copper PCB, and lower RDS(on) MOSFETs, plus over-temperature design to deliver superior performance and longer system life.FRIENDLY PCB DESIGNFully automated production process ensures top quality of the circuit boards and eliminates sharp protrusions of the solder connectors seen on the conventional PCB surface. This friendly design prevents your hands from getting cut or inadvertently damaging components when making your build.GIGABYTE CONTROL CENTERGIGABYTE CONTROL CENTER (GCC) is a unified software for all GIGABYTE supported products. It provides an intuitive interface that allows users to adjust clock speed, voltage, fan mode and power target in real-time.AMD Radeon™ Anti-LagMinimizes input lag so you can game like a champion.AMD Radeon™ BoostDelivers extra performance and responsiveness when you need it most.AMD Radeon™ Image SharpeningImproves in-game visuals with virtually no impact to performance.AMD Radeon™ Super ResolutionIn-driver upscaler powered by FSR 1.0, elevates performance across thousands of games.In-driver upscaler powered by FSR 1.0, elevates performance across thousands of games.AMD Noise SuppressionReduces background audio noise from your surrounding environment for clearer communication.AMD LinkConnect your phone, tablet, TV, or Windows-based PC and play your games from almost anywhere in the world.

Supermicro MBD-X12SPW-TF-O 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots 1 PCI-E 4.0 x16 Right Riser Slot, 1 PCI-E 4.0 x32 Left Riser Slot, 4 PCI-E 4.0 NVMe x4 Internal Port(s) M.2 Interface: PCI-E 3.0 x4 and SATA M.2 Form Factor: 2280, 22110 M.2 Key: M-Key Dual LAN with 10GBase-T with Intel® X550 Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 I/O: 1 VGA, 2 COM, TPM header 2 SuperDOM with built-in power